Products & Services

 
   

Multiple Wire Sawing
Multiple-wire saw technique is one of the Free Abrasive Machining (FAM) technologies used to slice various type of material such as ceramic, ferrite and silicon to the thickness down to 0.100 mm with fine surface finish. This technology is widely used in wafer production in semiconductor and photovoltaic (PV) industry.

Abrasive slurry such as Silicon Carbide and diamond with different grit sizes are used at AKTY to yield the best result. We use copper wire as thin as 0.070 mm to achieve minimum kerf loss and maximum productivity.

Size of Work Piece (max)
: 80mm x 85mm x 90mm
Type of Work Piece : Ceramic, Ferrite, Garnet, Magnet, Metals.
Final Thickness : 0.1mm to 1.0mm
Thickness Tolerance : +/- 0.015 mm
Wire Diameter : 0.07mm to 0.20mm

 
   
Lapping & Polishing
At AKTY Technologies, we have developed the method and technology to lap various types of work-piece such as ceramic, alumina, zirconia, silicon, AlTiC, glass, stainless steel and others by using both double-side and single-side lapping machine. Different types of lapping plate and slurry are also used to achieve best result in terms of thickness, flatness, parallelism and surface finishing according to customer requirements.

Ceramic thickness as thin as 0.100 +/- 0.002 mm can be achieved without any difficulty in AKTY Technologies. Our lapping facility has the flexibility to cater small quantity as well as mass production requirements.

Size of Work Piece (max)
: 6" x 6" (150mm x 150mm)
Type of Work Piece : Ceramic,Ferrite, Garnet, Magnet, Metals.
Final Thickness : Down to 0.07mm
Final Thickness Tolerance : Down to +/- 0.002 um
Type of Abrasive : Diamond, GC, WA, etc.
Surface Flatness : 1.5um/cm
Surface Finish

: 0.2 - 0.6um (Lapped)
  < 0.0254 um (Polished)


 
   

Grinding, Grooving & Slicing
At AKTY Technologies, we slice parts in MICRO and we slice cost in MACRO.

Throughout years of experience, we have developed the most efficiency methods in the grinding, grooving and slicing technology. We are able to grind, groove and slicing all sorts of material especially advance ceramics. Tolerance down to +/- 5um is achievable upon request. We have the flexibility to cater for both large and small quantity orders.

Size of Work Piece (max)
: 6" x 6" (150mm x 150mm)
Type of Work Piece : Alumina, AlTiC, Zirconia, Glass, Barium/Calcium   Titanate, Garnet, Magnet, Ferrite, etc.
Thickness of Work Piece : 0.300 to 4.00 mm
Final Part : As small as 0.500mm x 0.500mm
Diamond Blade Thickness : 0.100 mm to 1.00mm
Standard Tolerance : +/- 0.020 mm (Tighter tolerances are available upon   request)

 
   

Thick Film Printing (Metallization)
We provide metal film printing such as Ag (Silver), Ag-Pt (Silver-Platinum), Ag-Pd (Silver-Palladium) on ceramic substrates. Chain conveyor type of high temperature furnace with multi-phase firing temperature setting (up to 1100ºC) is used to ensure highest quality of metal films. Characteristics of the product such as capacitance, inductance, resistance, conductance, quality factor, dissipation factor and phase angle can also be measured using our Impedance Analyzer and LCR meter.

Size of Work Piece (max)
: 300mm x 200mm
Type of Work Piece : Ceramic
Printing Paste : Ag, Ag-Pt, Ag-Pd and others upon request
Printing Screen : Stainless steel type with different mesh size
Final Thickness (Fired) : 10 to 30 um
Thickness Tolerance : 3 um per inch
Firing Furnace

: Conveyor type with 4-stage temperature setting   (maximum temperature: 1100 degree C)

 
         
 
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