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AKTY Technologies Sdn Bhd
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Multiple Wire Saw To Slice Substrate To Thin Plates

  2. Our Services
  3. Engineering Services (Ultimate Surface Finish)
  4. Multiple Wire Saw To Slice Substrate To Thin Plates
Multiple Wire Saw To Slice Substrate To Thin Plates
  • Thin Plate Cutting
  • Wire Saw Slicing
  • Substrate Slicing

    • More Services

    Dicing

    Dicing
    Centerless Grinding

    Centerless Grinding
    Lapping To Controlled Flatness Level

    Lapping To Controlled Flatness Level
    Surface Grinding

    Surface Grinding
    Grooving To Specification

    Grooving To Specification
    Polishing To Mirror Surface Finish

    Polishing To Mirror Surface Finish
    Refurbishing And Reconditioning

    Refurbishing And Reconditioning

    Make Appointment

    We would be more than happy to solve your problem and question, please arrange your appointment with us.

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